服務(wù)熱線：15102826285
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FR系列有鹵素粘結(jié)片（簡稱純膠） |
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產(chǎn)品型號 |
膠厚度(um) |
產(chǎn)品編碼 |
膠厚度(um) |
包裝規(guī)格 |
應(yīng)用領(lǐng)域 |
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FR0100 |
1（25） |
FR0400 |
4(102) |
24in(W)*250ft |
FPC多層板、硬板及軟硬結(jié)合板層間復(fù)合 |
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FR0200 |
1（51） |
FR1500 |
1/2(13) |
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FR0300 |
1（76） |
FR1501 |
0.7（18） |
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LF系列無鹵素粘結(jié)片（簡稱純膠） |
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產(chǎn)品型號 |
膠厚度(um) |
產(chǎn)品編碼 |
膠厚度(mm) |
包裝規(guī)格 |
應(yīng)用領(lǐng)域 |
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LF0100 |
1（25） |
LF0400 |
4(102) |
24in(W)*250ft |
FPC多層板、硬板及軟硬結(jié)合板層間復(fù)合 |
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LF0200 |
1（51） |
LF1500 |
1/2(13) |
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LF0300 |
1（76） |
LF1501 |
0.7（18） |
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HXC系列黑色覆蓋膜 |
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產(chǎn)品型號 |
膠ADH厚度(um) |
PI厚度（um） |
包裝規(guī)格 |
應(yīng)用領(lǐng)域
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HXC1215 |
0.6(15) |
12 |
249mm*200m |
蘋果項(xiàng)目指定的黑色環(huán)氧型epoxy覆蓋膜,保質(zhì)期4個(gè)月 |
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HXC1220 |
0.8(20) |
12 |
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HXC1225 |
1(25) |
12 |
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HXC2525 |
1(25) |
25 |
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FR系列黃色覆蓋膜Coverlay（含鹵素） |
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產(chǎn)品型號 |
膠ADH厚度(um) |
PI厚度（um） |
包裝規(guī)格 |
應(yīng)用領(lǐng)域 |
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FR0110 |
1(25) |
25 |
24in(610mm)* |
工業(yè)類通用的黃色覆蓋膜，阻燃等級比無鹵LF系列要高。 |
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FR0120 |
1(25) |
51 |
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FR7001 |
1/2(13) |
13 |
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FR7013 |
1(25) |
13 |
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LF系列黃色覆蓋膜Coverlay（無鹵素） |
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產(chǎn)品型號 |
膠ADH厚度(um) |
PI厚度（um） |
包裝規(guī)格 |
應(yīng)用領(lǐng)域 |
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LF0110 |
1(25) |
25 |
24in(610mm)* |
光電類及工業(yè)類無鹵素黃色覆蓋膜，正常工作溫度可達(dá)140°C |
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LF0120 |
1(25) |
51 |
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LF7001 |
1/2(13) |
13 |
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LF7013 |
1(25) |
13 |
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FR系列Bondply（簡稱兩面帶膠PI，含鹵素） |
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產(chǎn)品型號 |
膠ADH厚度(um)兩面 |
PI厚度（um） |
包裝規(guī)格 |
應(yīng)用領(lǐng)域 |
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FR0111 |
1(25) |
25 |
24in(610mm)* |
雙面帶膠PI，Acrylic膠系，常溫密封保存，應(yīng)用于多層板內(nèi)層和軟硬結(jié)合板內(nèi)層，尤其針對內(nèi)層2+2結(jié)構(gòu)，雙面有蝕刻線路的疊層結(jié)構(gòu)，良好的填充性能，優(yōu)化結(jié)構(gòu)，同時(shí)減少壓合次數(shù) |
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FR0121 |
1(25) |
51 |
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FR0131 |
1(25) |
76 |
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FR0212 |
2（51） |
25 |
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FR7021 |
1/2（13） |
1/2（13） |
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FR7016 |
1(25) |
1/2（13） |
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FR7081 |
2（51） |
1/2（13） |
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FR1515 |
1/2（13） |
25 |
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LF系列Bondply（簡稱兩面帶膠PI，無鹵素） |
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產(chǎn)品型號 |
膠ADH厚度(um) |
PI厚度（um） |
包裝規(guī)格 |
應(yīng)用領(lǐng)域 |
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LF0111 |
1(25) |
25 |
24in(610mm)* |
雙面帶膠PI，Acrylic膠系，常溫密封保存，應(yīng)用于多層板內(nèi)層和軟硬結(jié)合板內(nèi)層，尤其針對內(nèi)層2+2結(jié)構(gòu)，雙面有蝕刻線路的疊層結(jié)構(gòu)，良好的填充性能，優(yōu)化結(jié)構(gòu)，同時(shí)減少壓合次數(shù) |
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LF0121 |
1(25) |
51 |
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LF0131 |
1(25) |
76 |
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LF0212 |
2（51） |
25 |
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LF7021 |
1/2（13） |
1/2（13） |
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LF7016 |
1(25) |
1/2（13） |
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LF7081 |
2（51） |
1/2（13） |
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LF1515 |
1/2（13） |
25 |
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HXN系列超薄黃色覆蓋膜Coverlay(環(huán)氧型) |
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產(chǎn)品型號 |
膠ADH厚度(um) |
PI厚度（um） |
包裝規(guī)格 |
應(yīng)用領(lǐng)域 |
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HXN0510 |
0.4（10） |
5 |
250mm*200m |
環(huán)氧型超薄覆蓋膜，LCM模組專用，良好的柔韌性能 |
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HXN0515 |
0.6(15) |
5 |
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HXN0810 |
0.4（10） |
8 |
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HXN0815 |
0.6(15) |
8 |
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FR系列單面有膠基材（含鹵素） |
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產(chǎn)品型號 |
Cu OZ/ft2(um) |
膠厚度（um） |
PI厚度（um） |
包裝規(guī)格 |
應(yīng)用領(lǐng)域 |
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FR9110R |
1(35) |
25 |
25 |
24in(610 mm)* |
工業(yè)類單面有膠基材，正常工作溫度可達(dá)140°C，主要應(yīng)用在工業(yè)類、光電類、汽車、醫(yī)療類 |
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FR9120R |
1(35) |
25 |
51 |
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FR9130R |
1(35) |
25 |
76 |
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FR9150R |
1(35) |
25 |
127 |
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FR系列雙面有膠基材（含鹵素） |
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產(chǎn)品型號 |
Cu OZ/ft2(um) |
膠厚度（um） |
PI厚度（um） |
包裝規(guī)格 |
應(yīng)用領(lǐng)域 |
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FR9111R |
1(35) |
25 |
25 |
24in(610 mm)* |
雙面粘合基材，工作溫度高達(dá)140°C，主要用于工業(yè)、光電、汽車、醫(yī)療和航天領(lǐng)域。 |
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FR9121R |
1(35) |
25 |
52 |
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FR9131R |
1(35) |
25 |
76 |
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FR9222R |
2(70) |
25 |
127 |
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LF系列單面有膠基材（無鹵） |
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產(chǎn)品型號 |
Cu OZ/ft2(um) |
膠厚度（um） |
PI厚度（um） |
包裝規(guī)格 |
應(yīng)用領(lǐng)域 |
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LF9110R |
1(35) |
25 |
25 |
24in(610 mm)* |
工業(yè)類單面有膠基材，正常工作溫度可達(dá)140°C，主要應(yīng)用在工業(yè)類、光電類、汽車、醫(yī)療類 |
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LF9120R |
1(35) |
25 |
51 |
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LF9130R |
1(35) |
25 |
76 |
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LF9150R |
1(35) |
25 |
51 |
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LF系列雙面有膠基材（無鹵） |
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產(chǎn)品型號 |
Cu OZ/ft2(um) |
膠厚度（um） |
PI厚度（um） |
包裝規(guī)格 |
應(yīng)用領(lǐng)域 |
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LF9111R |
1(35) |
25 |
25 |
24in(610 mm)* 25 sheets in a box |
工業(yè)類單面有膠基材，正常工作溫度可達(dá)140°C，主要應(yīng)用在工業(yè)類、光電類、汽車、醫(yī)療類 |
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LF9121R |
1(35) |
25 |
51 |
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LF9131R |
1(35) |
25 |
76 |
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LF9222R |
2(70) |
25 |
51 |
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無膠基材 |
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AC系列單面無膠基材 |
Cu um(OZ/ft2) |
PI厚度（um） |
Cu um(OZ/ft2) |
包裝規(guī)格 |
應(yīng)用領(lǐng)域 |
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AC121200EM/R |
12(1/3 ) |
12 |
12(1/3) |
250mm*100m |
消費(fèi)類電子單面無膠基材，應(yīng)用于普通單面板和多層軟板 |
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AC122000EM/R |
12(1/3) |
20 |
12(1/3) |
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AC182000EM/R |
18(1/2) |
20 |
18(1/2) |
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AC182500EM/R |
18(1/2) |
25 |
18(1/2) |
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AC181200EM/R |
18(1/2) |
12 |
18(1/2) |
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AC352500EY/R |
35(1.0) |
25 |
35(1.0) |
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AC354500EY/R |
35(1.0) |
45 |
35(1.0) |
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AK系列雙面無膠基材（HTE銅） |
Cu um(OZ/ft2) |
PI厚度（um） |
Cu um(OZ/ft2) |
包裝規(guī)格 |
應(yīng)用領(lǐng)域 |
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AK121212EM |
12(1/3) |
12 |
12(1/3) |
250mm*100m |
消費(fèi)類電子雙面無膠基材，高延展性電解銅，應(yīng)用于普通雙面板和軟硬結(jié)合板內(nèi)層，漲縮穩(wěn)定性好 |
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AK121812EM |
12(1/3) |
18 |
12(1/3) |
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AK122512EM |
12(1/3) |
25 |
12(1/3) |
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AK125012EM |
18(1/2) |
50 |
18(1/2) |
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AK182518EM |
18(1/2) |
25 |
18(1/2) |
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AK185018EM |
18(1/2) |
50 |
18(1/2) |
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AK系列雙面無膠基材（HA銅） |
Cu um(OZ/ft2) |
PI厚度（um） |
Cu um(OZ/ft2) |
包裝規(guī)格 |
應(yīng)用領(lǐng)域 |
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AK122512RY |
12(1/3) |
25 |
12(1/3) |
250mm*100m |
消費(fèi)類電子雙面無膠基材，HA高延展性壓延銅，應(yīng)用于普通雙面板和軟硬結(jié)合板內(nèi)層，折彎性能好 |
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AK182518RY |
18(1/2) |
25 |
18(1/2) |
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AK185018RY |
18(1/3) |
50 |
18(1/2) |
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KP系列雙面無膠基材 |
Cu um(OZ/ft2) |
PI厚度（um） |
Cu um(OZ/ft2) |
包裝規(guī)格 |
應(yīng)用領(lǐng)域 |
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KP122512E |
12(1/3) |
25 |
12(1/3) |
250mm*100m |
LCD、LCM、TP、攝像頭模組及消費(fèi)類電子應(yīng)用基材，良好的漲縮穩(wěn)定性，TD方向熱處理后3%以內(nèi)，MD方便可以達(dá)5%以內(nèi)。 |
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KP182518E |
18(1/2) |
25 |
18(1/2) |
250mm*100m |
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AP系列雙面無膠基材 |
Cu um(OZ/ft2) |
PI厚度（um） |
Cu um(OZ/ft2) |
包裝規(guī)格 |
應(yīng)用領(lǐng)域 |
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AP8515R |
18(1/2) |
25 |
18(1/2) |
24in(610mm)* |
工業(yè)類雙面無膠基材，正常工作溫度可達(dá)180°C，傳輸速度可達(dá)10GHZ左右,主要應(yīng)用在工業(yè)類、光電模塊類、汽車、醫(yī)療、航空航天類 |
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AP8525R |
18(1/2) |
51 |
18(1/2) |
24in(610 mm)* |
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AP9111R |
1(35) |
25 |
1(35) |
24in(610mm)* |
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AP9121R |
1(35) |
51 |
1(35) |
12in(610mm)* |
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AP9131R |
1(35) |
76 |
1(35) |
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Pyralux? JT |
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產(chǎn)品編號 |
PI厚度（um） |
材料特性及應(yīng)用領(lǐng)域 |
包裝規(guī)格 |
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JT25 |
25 |
Polyamideimide材質(zhì)，正常工作溫度可以達(dá)150° |
24in(W)*250ft |
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JT50 |
50 |
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Pyralux? HT |
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產(chǎn)品編號 |
PI厚度（um） |
材料特性及應(yīng)用領(lǐng)域 |
包裝規(guī)格 |
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HT0100 |
25 |
正常工作溫度可以耐225°；需要高溫壓機(jī)壓合，溫度達(dá)300°以上 |
24in(W)*250ft |
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HT7049 |
38 |
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HT0200 |
50 |
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HT0300 |
75 |
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HT系列工業(yè)類耐高溫的基材 |
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HT系列雙面無膠基材 |
Cu um(OZ/ft2) |
PI厚度（um） |
Cuum(OZ/ft2) |
包裝規(guī)格 |
應(yīng)用領(lǐng)域 |
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HT8515R |
18(1/2) |
25 |
18(1/2) |
24in(610mm)* |
全聚酰亞胺系雙面無膠基材，當(dāng)今耐溫值最高的軟板材料，工作溫度可達(dá)225°C以上，高結(jié)合力，優(yōu)異的絕緣層厚度均勻度和電氣性能 |
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HT8525R |
18(1/2) |
51 |
18(1/2) |
24in(610mm)* |
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HT9111R |
1(35) |
25 |
1(35) |
24in(610mm)* |
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HT9121R |
1(35) |
51 |
1(35) |
12in(610mm)* |
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FR series has halogen bonding sheet (referred to as pure glue) |
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Product Model |
mil(um)Thickness of adhesive |
Product Code |
mil(um)Thickness of adhesive |
Packaging specifications |
Application Areas |
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FR0100 |
1（25） |
FR0400 |
4(102) |
24in(W)*250ft |
FPC multilayer, rigid and rigid-soft combination board interlayer lamination |
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FR0200 |
1（51） |
FR1500 |
1/2(13) |
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FR0300 |
1（76） |
FR1501 |
0.7（18） |
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LF series halogen-free bonding sheet (referred to as pure glue) |
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Product Model |
mil(um)Thickness of adhesive |
Product Code |
mil(mm)Thickness of adhesive |
Packaging specifications |
Application Areas |
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LF0100 |
1（25） |
LF0400 |
4(102) |
24in(W)*250ft |
FPC multilayer, rigid and rigid-soft combination board interlayer lamination |
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LF0200 |
1（51） |
LF1500 |
1/2(13) |
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LF0300 |
1（76） |
LF1501 |
0.7（18） |
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Coverlay HXC Series Black Coverlay Film Coverlay |
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Product Model |
mil(um)Gum ADH thickness |
（um）Thickness of PI |
Packaging specifications |
Application Areas |
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HXC1215 |
0.6(15) |
12 |
249mm*200m |
Black epoxy covering film specified by Apple project, with a shelf life of 4 months |
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HXC1220 |
0.8(20) |
12 |
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HXC1225 |
1(25) |
12 |
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HXC2525 |
1(25) |
25 |
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FR series yellow overlay film Coverlay (with halogen) |
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Product Model |
mil(um)Gum ADH thickness |
（um）Thickness of PI |
Packaging specifications |
Application Areas |
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FR0110 |
1(25) |
25 |
24in(610mm)* |
A general-purpose yellow covering film for industrial classes with a higher flame retardant rating than the halogen-free LF series. |
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FR0120 |
1(25) |
51 |
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FR7001 |
1/2(13) |
13 |
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FR7013 |
1(25) |
13 |
||
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LF series yellow overlay film Coverlay (with halogen) |
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Product Model |
mil(um)Gum ADH thickness |
（um）Thickness of PI |
Packaging specifications |
Application Areas |
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LF0110 |
1(25) |
25 |
24in(610mm)* |
Halogen-free yellow covering film for optoelectronic and industrial applications, with normal operating temperature up to 140°C |
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LF0120 |
1(25) |
51 |
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LF7001 |
1/2(13) |
13 |
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LF7013 |
1(25) |
13 |
||
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FR series Bondply (referred to as two-sided adhesive PI, containing halogen) |
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Product Model |
mil(um)Gum ADH thicknessBoth sides |
（um）Thickness of PI |
Packaging specifications |
Application Areas |
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FR0111 |
1(25) |
25 |
24in(610mm)* |
Double-sided PI with adhesive, Acrylic adhesive system, sealed and stored at room temperature, used in the inner layer of multilayer boards and the inner layer of soft and hard combination boards, especially for the inner layer of 2+2 structure, double-sided laminated structure with etched lines, good filling performance, optimize the structure, while reducing the number of presses |
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FR0121 |
1(25) |
51 |
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FR0131 |
1(25) |
76 |
||
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FR0212 |
2（51） |
25 |
||
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FR7021 |
1/2（13） |
1/2（13） |
||
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FR7016 |
1(25) |
1/2（13） |
||
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FR7081 |
2（51） |
1/2（13） |
||
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FR1515 |
1/2（13） |
25 |
||
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LF series Bondply (referred to as two-sided adhesive PI, halogen-free) |
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Product Model |
mil(um)Gum ADH thickness |
（um）Thickness of PI |
Packaging specifications |
Application Areas |
|
LF0111 |
1(25) |
25 |
24in(610mm)* |
Double-sided PI with adhesive, Acrylic adhesive system, sealed and stored at room temperature, used in the inner layer of multilayer boards and the inner layer of soft and hard combination boards, especially for the inner layer of 2+2 structure, double-sided laminated structure with etched lines, good filling performance, optimize the structure, while reducing the number of presses |
|
LF0121 |
1(25) |
51 |
||
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LF0131 |
1(25) |
76 |
||
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LF0212 |
2（51） |
25 |
||
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LF7021 |
1/2（13） |
1/2（13） |
||
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LF7016 |
1(25) |
1/2（13） |
||
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LF7081 |
2（51） |
1/2（13） |
||
|
LF1515 |
1/2（13） |
25 |
||
|
HXN series ultra-thin yellow covering film Coverlay (epoxy type) |
||||
|
Product Model |
mil(um)Gum ADH thickness |
（um）Thickness of PI |
Packaging specifications |
Application Areas |
|
HXN0510 |
0.4（10） |
5 |
250mm*200m |
Epoxy type ultra-thin covering film for LCM module, good flexibility performance |
|
HXN0515 |
0.6(15) |
5 |
||
|
HXN0810 |
0.4（10） |
8 |
||
|
HXN0815 |
0.6(15) |
8 |
||
|
FR series single-sided glued substrates (with halogen) |
|||||
|
Product Model |
Cu OZ/ft2(um) |
Thickness of adhesive |
（um） Thickness of PI |
Packaging specifications |
Application Areas |
|
FR9110R |
1(35) |
25 |
25 |
24in(610 mm)* |
Industrial single-sided adhesive substrates, normal working temperature up to 140°C, mainly used in industrial, optoelectronic, automotive, medical |
|
FR9120R |
1(35) |
25 |
51 |
||
|
FR9130R |
1(35) |
25 |
76 |
||
|
FR9150R |
1(35) |
25 |
127 |
||
|
FR series double-sided adhesive substrates (with halogen) |
|||||
|
Product Model |
Cu OZ/ft2(um) |
Thickness of adhesive |
（um）Thickness of PI |
Packaging specifications |
Application Areas |
|
FR9111R |
1(35) |
25 |
25 |
24in(610 mm)* |
Double-sided adhesive substrate, working temperature up to 140°C, mainly used in industrial, optoelectronic, automotive, medical and aerospace applications |
|
FR9121R |
1(35) |
25 |
52 |
||
|
FR9131R |
1(35) |
25 |
76 |
||
|
FR9222R |
2(70) |
25 |
127 |
||
|
LF series single-sided adhesive base material (halogen-free) |
|||||
|
Product Model |
Cu OZ/ft2(um) |
（um）Thickness of adhesive |
（um）Thickness of PI |
Packaging specifications |
Application Areas |
|
LF9110R |
1(35) |
25 |
25 |
24in(610 mm)* |
Industrial single-sided adhesive substrates, normal working temperature up to 140°C, mainly used in industrial, optoelectronic, automotive, medical |
|
LF9120R |
1(35) |
25 |
51 |
||
|
LF9130R |
1(35) |
25 |
76 |
||
|
LF9150R |
1(35) |
25 |
51 |
||
|
LF series double-sided adhesive base material (halogen-free) |
|||||
|
Product Model |
Cu OZ/ft2(um) |
（um）Thickness of adhesive |
（um）Thickness of PI |
Packaging specifications |
Application Areas |
|
LF9111R |
1(35) |
25 |
25 |
24in(610 mm)* 25 sheets in a box |
Industrial single-sided adhesive substrates, normal working temperature up to 140°C, mainly used in industrial, optoelectronic, automotive, medical |
|
LF9121R |
1(35) |
25 |
51 |
||
|
LF9131R |
1(35) |
25 |
76 |
||
|
LF9222R |
2(70) |
25 |
51 |
||
|
Non-adhesive substrates |
|||||
|
AC series single-sided non-adhesive substrate |
Cu um(OZ/ft2) |
（um）Thickness of PI |
Cu um(OZ/ft2) |
Packaging specifications |
Application Areas |
|
AC121200EM/R |
12(1/3) |
12 |
12(1/3) |
250mm*100m |
Consumer electronics single-sided adhesive-free substrates for general single-sided and multilayer flexible boards |
|
AC122000EM/R |
12(1/3) |
20 |
12(1/3) |
||
|
AC182000EM/R |
18(1/2) |
20 |
18(1/2) |
||
|
AC182500EM/R |
18(1/2) |
25 |
18(1/2) |
||
|
AC181200EM/R |
18(1/2) |
12 |
18(1/2) |
||
|
AC352500EY/R |
35(1.0) |
25 |
35(1.0) |
||
|
AC354500EY/R |
35(1.0) |
45 |
35(1.0) |
||
|
AK series double-sided adhesive-free substrates (HTE copper) |
Cu um(OZ/ft2) |
（um）Thickness of PI |
Cu um(OZ/ft2) |
Packaging specifications |
Application Areas |
|
AK121212EM |
12(1/3) |
12 |
12(1/3) |
250mm*100m |
Consumer electronics double-sided adhesive-free substrate, high ductility electrolytic copper, applied to the ordinary double-sided board and the inner layer of soft and hard combination board, good up and down stability |
|
AK121812EM |
12(1/3) |
18 |
12(1/3) |
||
|
AK122512EM |
12(1/3) |
25 |
12(1/3) |
||
|
AK125012EM |
18(1/2) |
50 |
18(1/2) |
||
|
AK182518EM |
18(1/2) |
25 |
18(1/2) |
||
|
AK185018EM |
18(1/2) |
50 |
18(1/2) |
|
AK series double-sided adhesive-free substrate (HA copper) |
Cu um(OZ/ft2) |
（um）Thickness of PI |
Cu um(OZ/ft2) |
Packaging specifications |
Application Areas |
|
AK122512RY |
12(1/3) |
25 |
12(1/3) |
250mm*100m |
Consumer electronics double-sided adhesive-free substrate, HA high ductility calendered copper, applied to the ordinary double-sided and soft-hard combination board inner layer, good bending performance |
|
AK182518RY |
18(1/2) |
25 |
18(1/2) |
||
|
AK185018RY |
18(1/3) |
50 |
18(1/2) |
|
KP series double-sided adhesive-free substrate |
Cu um(OZ/ft2) |
（um）Thickness of PI |
Cu um(OZ/ft2) |
Packaging specifications |
Application Areas |
|
KP122512E |
12(1/3) |
25 |
12(1/3) |
250mm*100m |
LCD, LCM, TP, camera modules and consumer electronics application substrates, good up and down stability, within 3% after TD direction heat treatment, MD convenience can reach within 5%. |
|
KP182518E |
18(1/2) |
25 |
18(1/2) |
250mm*100m |
|
AP series double-sided adhesive-free substrate |
Cu um(OZ/ft2) |
（um）Thickness of PI |
Cu um(OZ/ft2) |
Packaging specifications |
Application Areas |
|
AP8515R |
18(1/2) |
25 |
18(1/2) |
24in(610mm)* |
Industrial double-sided adhesive-free substrates, normal working temperature up to 180°C, transmission speed up to about 10GHZ, mainly used in industrial, optoelectronic modules, automotive, medical, aerospace class |
|
AP8525R |
18(1/2) |
51 |
18(1/2) |
24in(610 mm)* |
|
|
AP9111R |
1(35) |
25 |
1(35) |
24in(610mm)* |
|
|
AP9121R |
1(35) |
51 |
1(35) |
12in(610mm)* |
|
|
AP9131R |
1(35) |
76 |
1(35) |
|
Pyralux? JT Coverfilm and Bonding Material |
|||
|
Product No. |
（um）Thickness of PI |
Material properties and application areas |
Packaging specifications |
|
JT25 |
25 |
Polymide material, normal operating temperature can reach 150°. |
24in(W)*250ft |
|
JT50 |
50 |
||
|
Pyralux? HT Coverfilm and Bonding Material |
|||
|
Product No. |
（um）Thickness of PI |
Material properties and application areas |
Packaging specifications |
|
HT0100 |
25 |
Normal working temperature can withstand 225°; need high temperature press to press together, the temperature reaches 300° or more |
24in(W)*250ft |
|
HT7049 |
38 |
||
|
HT0200 |
50 |
||
|
HT0300 |
75 |
||
|
HT series industrial class high temperature resistant substrates |
|||||
|
HT series double-sided adhesive-free substrate |
Cu um(OZ/ft2) |
（um）Thickness of PI |
Cu um(OZ/ft2) |
Packaging specifications |
Application Areas |
|
HT8515R |
18(1/2) |
25 |
18(1/2) |
24in(610mm)* |
All-polyimide double-sided non-adhesive base material, the highest temperature resistance of today's flexible board materials, working temperature up to 225 ° C or more, high bonding force, excellent insulation layer thickness uniformity and electrical performance |
|
HT8525R |
18(1/2) |
51 |
18(1/2) |
24in(610mm)* |
|
|
HT9111R |
1(35) |
25 |
1(35) |
24in(610mm)* |
|
|
HT9121R |
1(35) |
51 |
1(35) |
12in(610mm)* |
|
