服務(wù)熱線：15102826285
干膜應(yīng)用領(lǐng)域
◆Riston?產(chǎn)品涵蓋電路板、陶瓷板和TP行業(yè)制造所需的影像轉(zhuǎn)移干膜，包括曝光蝕刻、掩孔蝕刻、圖形電鍍、精細(xì)線路電鍍/蝕刻、鎳金電鍍、選擇性沉鎳金、激光直接成像、半加成法、封裝基板等。
|
干膜型號 |
厚度（UM） |
應(yīng)用領(lǐng)域 |
主要特性 |
|
SD200 |
20，25，30，38，50 |
內(nèi)層，外層酸性蝕刻圖形制作 |
蓋孔能力強(qiáng)，去膜速度快，膜屑小 |
|
外層圖形電鍍堿性蝕刻圖形制作 |
高解像度，凹坑填覆能力強(qiáng)，抗?jié)B鍍，無鋸齒線 |
||
|
ST900 |
15，25，30，38，50 |
內(nèi)層酸性蝕刻、FPC圖形制作、ITO應(yīng)用 |
高解像度，去膜速度快，膜屑小 |
|
PM300 |
30，38,50 |
內(nèi)層，外層酸性蝕刻和堿性蝕刻 |
操作窗口寬，去膜速度快，膜屑小 |
|
FM700 |
30,40 |
內(nèi)層，外層酸性蝕刻 |
產(chǎn)速快，去膜速度快，膜屑小 |
|
FM800 |
20,25,30 |
FPC和軟硬結(jié)合板的理想選擇 |
超精細(xì)解析度和附著力強(qiáng) |
|
W200 |
50，55，65，75 |
選擇性化學(xué)鎳金表面處理 |
抗?jié)B鍍能力強(qiáng)，析出量低 |
|
GPM200 |
30,40,50 |
外層電鍍NI/AU，薄金、厚金專用 |
抗?jié)B鍍能力強(qiáng)，無鋸齒線 |
|
LDI7200M |
30,38 |
激光直接成像（355nm）線路形成，適合酸性蝕刻和堿性蝕刻 |
蓋孔能力強(qiáng)，高解像度，附著力高 |
|
LDI7300M |
20,25,30,38 |
激光直接成像（355nm）線路形成 |
高解像度，附著力高，曝光速度快 |
|
LDI7500 |
20，25，30 |
激光直接成像（355nm）線路形成,適合做pitch≤80um的精細(xì)線路 |
高解像度，附著力高，曝光速度快 |
|
LDI8000 |
30,38 |
激光直接成像（405nm）線路形成 |
高穩(wěn)定性，產(chǎn)能高 |
Dry Film Application Areas
◆Riston? products cover image transfer dry films for circuit board, ceramic board and TP industry manufacturing, including exposure etching, mask etching, graphic plating, fine line plating/etching, nickel-gold plating, selective nickel-gold deposition, laser direct imaging, semi-additive method, packaging substrates, etc.
|
Dry Film Model |
（UM）Thicknesses |
Application Areas |
Main Features |
|
SD200 |
20，25，30，38，50 |
Inner layer, outer layer acid etching graphic production |
Strong hole-covering ability, fast film removal, small film chips |
|
Production of alkaline etched graphics for outer layer graphics plating |
High resolution, high crater filling capability, anti-seepage plating, no jagged lines |
||
|
ST900 |
15，25，30，38，50 |
Inner layer acid etching, FPC graphic production, ITO application |
High resolution, fast film removal, small film chip |
|
PM300 |
30，38,50 |
Inner layer, outer layer acid etching and alkaline etching |
Wide operating window, fast de-filming speed, small film chips |
|
FM700 |
30,40 |
Inner layer, outer layer acid etching |
Fast production speed, fast film removal, small film flakes |
|
FM800 |
20,25,30 |
Ideal for FPC and rigid-flex boards |
Ultra-fine resolution and high adhesion |
|
W200 |
50，55，65，75 |
Selective chemical nickel-gold surface treatment |
High resistance to seepage plating and low precipitation |
|
GPM200 |
30,40,50 |
NI/AU plating on the outer layer, for thin gold and thick gold |
High resistance to bleed plating, no jagged lines |
|
LDI7200M |
30,38 |
Laser direct imaging (355nm) line formation for acid etching and alkaline etching |
Strong hole-covering ability, high resolution, and high adhesion |
|
LDI7300M |
20,25,30,38 |
Laser direct imaging (355nm) line formation |
High resolution, high adhesion, fast exposure speed |
|
LDI7500 |
20，25，30 |
Laser direct imaging (355nm) line formation, suitable for fine lines with pitch ≤ 80um |
High resolution, high adhesion, fast exposure speed |
|
LDI8000 |
30,38 |
Laser direct imaging (405nm) line formation |
High stability, high capacity |
